Avient Edgetek® PF-20CF/000 Polysulfone

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Avient Edgetek® PF-20CF/000 Polysulfone (discontinued **)
Categories:	Polymer; Thermoplastic; Polysulfone (PSU)
Material Notes:	The Edgetek® Engineering Thermoplastic Compounds portfolio covers a broad range of standard and custom-formulated high performance materials. This portfolio includes high-temperature materials for elevated service temperature environments, high-modulus / structural materials for load-bearing and high-strength applications and flame-retardant products. These compounds are based on select engineering thermoplastic resins that are compounded with reinforcing additives such as carbon fiber, glass fiber and glass beads. Description/Features: PSU (Polysulfone) 20% Carbon Fiber Reinforced Hi-Temp Applications: Multi-purpose Processing Method: Injection Molding Information provided by PolyOne Corporation
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Physical Properties	Metric	English	Comments

Specific Gravity	1.31 g/cc	1.31 g/cc	ASTM D792
Water Absorption	0.20 % @Thickness 3.17 mm	0.20 % @Thickness 0.125 in	24 hr. Immersion; ASTM D570
Linear Mold Shrinkage	0.0010 - 0.0020 cm/cm	0.0010 - 0.0020 in/in	ASTM D955

Mechanical Properties	Metric	English	Comments
Tensile Strength, Yield	128 MPa	18500 psi	Type 1 - Rigids, Yield, 0.2 in/min; ASTM D638
Elongation at Break	2.0 - 4.0 %	2.0 - 4.0 %	Type 1 - Rigids, 0.2 in/min; ASTM D638
Tensile Modulus	11.0 GPa	1600 ksi	Type 1 - Rigids, 0.2 in/min; ASTM D638
Flexural Strength	155 MPa	22500 psi	ASTM D790
Flexural Modulus	11.0 GPa	1600 ksi	ASTM D790
Izod Impact, Notched	0.854 J/cm @Thickness 3.17 mm, Temperature 23.0 °C	1.60 ft-lb/in @Thickness 0.125 in, Temperature 73.4 °F	Method A, Injection Molded; ASTM D256

Thermal Properties	Metric	English	Comments
Deflection Temperature at 1.8 MPa (264 psi)	179 °C	355 °F	Unannealed; ASTM D648

Processing Properties	Metric	English	Comments
Melt Temperature	354 - 377 °C	670 - 710 °F	Molding

**
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PH1PO0568a / 43611

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