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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.

Mitsubishi Chemical Advanced Materials Sultron™ PSU Extruded Unfilled Polysulfone
Categories: Polymer; Thermoplastic; Polysulfone (PSU)

Material Notes: Sultron™ Polysulfone PSU is a translucent material that offers a combination of excellent mechanical, thermal, and electrical properties. This grade often replaces polycarbonate whenever higher temperature resistance, improved chemical resistance, or autoclavability is required.

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Physical PropertiesMetricEnglishComments
Specific Gravity 1.24 g/cc1.24 g/ccASTM D792
Water Absorption at Saturation 0.600 %0.600 %ASTM D570 (17)
 
Mechanical PropertiesMetricEnglishComments
Hardness, Rockwell M 89.089.0ASTM D785
Hardness, Shore D 80.080.0ISO 868
Tensile Strength 88.0 MPa12800 psiISO 527-1/-2 (7)
Elongation at Yield 5.00 %5.00 %ISO 527-1/-2 (7)
Flexural Strength 120 MPa17400 psiISO 178 (12)
Compressive Yield Strength  25.0 MPa
@Strain 1.00 %
3630 psi
@Strain 1.00 %
ISO 604 (10)
 49.0 MPa
@Strain 2.00 %
7110 psi
@Strain 2.00 %
ISO 604 (10)
 101 MPa
@Strain 5.00 %
14600 psi
@Strain 5.00 %
ISO 604 (10)
Shear Strength 62.0 MPa8990 psiASTM D732
Charpy Impact, Notched 0.350 J/cm²1.67 ft-lb/in²ISO 179-1/1eA
 
Electrical PropertiesMetricEnglishComments
Surface Resistivity per Square 1.00e+14 ohm1.00e+14 ohmANSI/ESD STM 11.11
Dielectric Constant 3.14
@Frequency 1.00e+6 Hz
3.14
@Frequency 1.00e+6 Hz
ASTM D150
Dielectric Strength 16.7 kV/mm425 kV/inASTM D149
 30.0 kV/mm762 kV/inIEC 60243-1 (15)
Dissipation Factor 0.000800
@Frequency 1.00e+6 Hz
0.000800
@Frequency 1.00e+6 Hz
ASTM D150
 
Thermal PropertiesMetricEnglishComments
CTE, linear 55.8 µm/m-°C31.0 µin/in-°FASTM E-831 (TMA)
 55.0 µm/m-°C
@Temperature 23.0 - 100 °C
30.6 µin/in-°F
@Temperature 73.4 - 212 °F
 55.0 µm/m-°C
@Temperature 23.0 - 150 °C
30.6 µin/in-°F
@Temperature 73.4 - 302 °F
 70.0 µm/m-°C
@Temperature >=150 °C
38.9 µin/in-°F
@Temperature >=302 °F
Thermal Conductivity 0.259 W/m-K1.80 BTU-in/hr-ft²-°F
 0.260 W/m-K1.80 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air 149 °C300 °FContinuous Use Temperature in Air after 20000 hr
Deflection Temperature at 1.8 MPa (264 psi) 171 °C340 °FASTM D648
Minimum Service Temperature, Air -50.0 °C-58.0 °F
Glass Transition Temp, Tg 190 °C374 °FDMA- Tan d
 
Chemical Resistance PropertiesMetricEnglishComments
Acids, Strong (pH 1-3) UnacceptableUnacceptable
Acids, Weak AcceptableAcceptable
Alcohols AcceptableAcceptable
Alkalies, Strong (pH 11-14) UnacceptableUnacceptable
Alkalies, Weak AcceptableAcceptable
Chlorinated Solvents UnacceptableUnacceptable
Continuous Sunlight LimitedLimited
Hot Water / Steam LimitedLimited
Hydrocarbons - Aliphatic LimitedLimited
Hydrocarbons - Aromatic UnacceptableUnacceptable
Inorganic Salt Solutions AcceptableAcceptable
Ketones, Esters UnacceptableUnacceptable
 
Descriptive Properties
ESd categoryInsulative

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P1SM50A / 20146

USP Class VI adhesives

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