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Ensinger PEI

Ensinger TECACOMP LCP LDS black 1049426 Liquid crystal polymer
Categories: Polymer; Thermoplastic; Liquid Crystal Polymer (LCP); Liquid Crystal Polymer (LCP), Unfilled

Material Notes:
  • developed for the LPKF-LDS® process
  • very low melt viscosity
  • very good chemical resistance
  • inherent flame retardant
  • good heat deflection temperature
  • low moisture absorption
Target Industries:
  • automotive industry
  • electrical engineering
  • LED lighting technology
  • mechanical engineering

Information provided by Ensinger Inc.

Vendors: Ensinger TECACOMP compounds withstand severe environments, resist harsh chemicals, and perform well in extreme temperatures. They offer weight savings that have potential to drive lower cost systems.

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Physical PropertiesMetricEnglishComments
Density 1.74 g/cc0.0629 lb/in³
Water Absorption at Saturation <= 0.10 %<= 0.10 %50 % relative humidity up to saturation; DIN EN ISO 62
Linear Mold Shrinkage, Flow 0.00030 cm/cm0.00030 in/inDIN EN ISO 294-4
Linear Mold Shrinkage, Transverse 0.0056 cm/cm0.0056 in/inDIN EN ISO 294-4
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength 85.0 MPa12300 psiDIN EN ISO 527-1
Elongation at Break 1.6 %1.6 %DIN EN ISO 527-1
Modulus of Elasticity 9.60 GPa1390 ksiDIN EN ISO 527-1
Charpy Impact Unnotched 1.50 J/cm²7.14 ft-lb/in²DIN EN ISO 179-1eU
 
Electrical PropertiesMetricEnglishComments
Volume Resistivity 1.00e+17 ohm-cm1.00e+17 ohm-cmDIN EN 61340-2-3
Surface Resistance 1.00e+15 ohm1.00e+15 ohmDIN EN 61340-2-3
Dielectric Constant 3.5
@Frequency 1e+9 Hz
3.5
@Frequency 1e+9 Hz
Dissipation Factor 0.0052
@Frequency 1e+9 Hz
0.0052
@Frequency 1e+9 Hz
Comparative Tracking Index 150 V150 VDIN EN 60112
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow  8.00 µm/m-°C
@Temperature 50.0 - 100 °C
4.44 µin/in-°F
@Temperature 122 - 212 °F
DIN EN ISO 11359-1;2
 11.0 µm/m-°C
@Temperature 100 - 150 °C
6.11 µin/in-°F
@Temperature 212 - 302 °F
DIN EN ISO 11359-1;2
 13.0 µm/m-°C
@Temperature 200 - 250 °C
7.22 µin/in-°F
@Temperature 392 - 482 °F
DIN EN ISO 11359-1;2
 14.0 µm/m-°C
@Temperature 150 - 200 °C
7.78 µin/in-°F
@Temperature 302 - 392 °F
DIN EN ISO 11359-1;2
CTE, linear, Transverse to Flow  34.0 µm/m-°C
@Temperature 50.0 - 100 °C
18.9 µin/in-°F
@Temperature 122 - 212 °F
DIN EN ISO 11359-1;2
 44.0 µm/m-°C
@Temperature 100 - 150 °C
24.4 µin/in-°F
@Temperature 212 - 302 °F
DIN EN ISO 11359-1;2
 53.0 µm/m-°C
@Temperature 150 - 200 °C
29.4 µin/in-°F
@Temperature 302 - 392 °F
DIN EN ISO 11359-1;2
 64.0 µm/m-°C
@Temperature 200 - 250 °C
35.6 µin/in-°F
@Temperature 392 - 482 °F
DIN EN ISO 11359-1;2
Thermal Conductivity 0.500 W/m-K3.47 BTU-in/hr-ft²-°Fthrough-plane; ISO 22007-4:2008
 2.10 W/m-K14.6 BTU-in/hr-ft²-°Fin-plane; ISO 22007-4:2008
Melting Point 310 °C590 °FDIN 53765
Maximum Service Temperature, Air 200 °C392 °Flong term
 260 °C500 °Fshort term
Deflection Temperature at 1.8 MPa (264 psi) 221 °C430 °FISO-R 75 Method A
Flammability, UL94 V-0
@Thickness 3.20 mm
V-0
@Thickness 0.126 in
DIN IEC 60695-11-10
 
Processing PropertiesMetricEnglishComments
Processing Temperature 290 - 350 °C554 - 662 °F
Mold Temperature 90.0 - 130 °C194 - 266 °F
Drying Temperature 130 - 150 °C266 - 302 °F
Dry Time 3.00 - 5.00 hour3.00 - 5.00 hour
 
Descriptive Properties
Colorblack

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PENSIO9001 / 318929

Chemically Resistant adhesives

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