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Master Bond adhesives

Celanese Hostaform® S 9364 XAP2 ™ POM, Impact Modified
Categories: Polymer; Thermoplastic; Acetal (Polyoxymethylene, POM); Acetal Copolymer, Impact Modified

Material Notes: Preliminary Data Sheet
Drying is suggested to help achieve low emission performance and to counter if material has contacted moisture through improper storage and handling.

Information provided by Celanese Corporation.

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Physical PropertiesMetricEnglishComments
Density 1.37 g/cc0.0495 lb/in³ISO 1183
Water Absorption at Saturation 0.80 %0.80 %ISO 62
 
Mechanical PropertiesMetricEnglishComments
Tensile Strength, Yield 43.0 MPa6240 psi50mm/min; ISO 527-2/1A
Elongation at Yield 16 %16 %50mm/min; ISO 527-2/1A
Tensile Modulus 1.65 GPa239 ksi1mm/min; ISO 527-2/1A
Flexural Modulus 1.55 GPa225 ksiISO 178
Charpy Impact Unnotched NBNBISO 179/1eU
 NB
@Temperature -30.0 °C
NB
@Temperature -22.0 °F
ISO 179/1eU
Charpy Impact, Notched 2.10 J/cm²9.99 ft-lb/in²ISO 179/1eA
 1.10 J/cm²
@Temperature -30.0 °C
5.23 ft-lb/in²
@Temperature -22.0 °F
ISO 179/1eA
 
Thermal PropertiesMetricEnglishComments
CTE, linear, Parallel to Flow 120 µm/m-°C66.7 µin/in-°FISO 11359-2
CTE, linear, Transverse to Flow 110 µm/m-°C61.1 µin/in-°FISO 11359-2
Melting Point 166 °C331 °FISO 11357-1,-2,-3
Deflection Temperature at 0.46 MPa (66 psi) 140 °C284 °FISO 75-1, -2
Deflection Temperature at 1.8 MPa (264 psi) 75.0 °C167 °FISO 75-1, -2
 
Processing PropertiesMetricEnglishComments
Processing Temperature 60.0 - 70.0 °C140 - 158 °Fcavity
Zone 1 170 - 180 °C338 - 356 °F
Zone 2 180 - 190 °C356 - 374 °F
Zone 3 180 - 190 °C356 - 374 °F
Zone 4 180 - 200 °C356 - 392 °F
Die Temperature 180 - 200 °C356 - 392 °F
Melt Temperature 180 - 200 °C356 - 392 °F
Drying Temperature 80.0 - 100 °C176 - 212 °F
Dry Time 3 hour3 hour
Injection Pressure 60.0 - 120 MPa8700 - 17400 psi
Hold Pressure 60.0 - 120 MPa8700 - 17400 psi
Back Pressure <= 0.500 MPa<= 72.5 psi
 
Descriptive Properties
Injection moldingYes
Injection speedslow
Melt volume rate (MVR), cm³/10min4
MVR test load, kg2.16
MVR test temperature, °C190
Processing conditions acc. ISO9988-2
Profile extrusionYes
RemarksDo not heat over 205 C (~400 F) to avoid burning and discoloring product.

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