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LECO for Empowering Results
Solvay CORFIL® 658 Potting Compound
Categories: Polymer; Thermoset; Polyimide, TS

Material Notes: Description: CORFIL 658 is a one-part epoxy material designed for use in insert or edge filling of honeycomb structure. The low viscosity of CORFIL 658 makes it especially suitable for automated or hand filling of small cell sized honeycomb. The thixotropic nature of CORFIL 658 ensures that there is no slump or resin separation during cure. CORFIL 658 is shipped frozen in sealed metal pails or plastic tubes packed with dry ice or by refrigerated carrier.

Features & Benefits:

  • Excellent spreadability and extrudability
  • Compatible with most 350°F (177°C) curing epoxy prepregs
  • Good compressive strength
Applications: Filling of honeycomb core in sandwich structures, especially in co-bond or co-cure applications

Information provided by Cytec, subsequently acquired by Solvay.

Available Properties
  • Density
  • Storage Temperature
  • Compressive Strength
  • Maximum Service Temperature, Air, Wet
  • Maximum Service Temperature, Air, Dry
  • Extrusion Rate
  • Shelf Life
Property Data

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Manufacturer Notes:
Solvay, former Rhodia Engineering Plastics

Category Notes

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Master Bond adhesives
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