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Master Bond adhesives
Rogers Arlon TC350 Thermally Conductive Ceramic Filled PTFE/Woven Fiberglass Laminate
Categories: Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)

Material Notes: Microwave material for improved thermal management - for microwave printed circuit boards

  • Thermal Conductivity and Dielectric Constant Stability across Wide Temperatures
  • Very Low Loss Tangent provides higher Amplifier or Antenna Efficiency
  • Easier to drill than traditional commercial based laminates utilizing thick and dense style woven glass
  • Priced Affordably for Commercial Applications
  • High Peel Strength for Reliable Copper Adhesion in thermally stressed applications

Benefits:

  • Heat Dissipation and Management
  • Improved Processing and Reliability
  • Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs

Typical Applications:

  • Power Amplifiers, Filters and Couplers
  • Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
  • Thermally Cycled Antennas sensitive to dielectric drift
  • Microwave Combiner and Power Dividers

Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.

Vendors:
Available Properties
  • Density, ASTM D792 Method A
  • Water Absorption, IPC TM-650 2.6.2.1
  • Outgassing - Total Mass Loss, NASA SP-R-0022A, Water Vapor Recovered
  • Outgassing - Total Mass Loss, NASA SP-R-0022A
  • Collected Volatile Condensable Material, NASA SP-R-0022A
  • Tensile Strength, IPC TM-650 2.4.18.3, Cross
  • Tensile Strength, IPC TM-650 2.4.18.3, Machine
  • Flexural Strength, IPC TM-650 2.4.4, Cross
  • Flexural Strength, IPC TM-650 2.4.4, Machine
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
  • Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
  • Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
  • Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
  • Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
  • Surface Resistance, IPC TM-650 2.5.17.1, E24/125
  • Dielectric Constant, IPC TM-650 2.5.5.3, may vary by thickness
  • Dielectric Constant, IPC TM-650 2.5.5.5, may vary by thickness
  • Dielectric Constant, Resonant Cavity, may vary by thickness
  • Dielectric Strength, IPC TM-650 2.5.6.2
  • Dielectric Breakdown, IPC TM-650 2.5.6
  • Dissipation Factor, IPC TM-650 2.5.5.3, may vary by thickness
  • Dissipation Factor, Resonant Cavity, may vary by thickness
  • Dissipation Factor, IPC TM-650 2.5.5.5, may vary by thickness
  • Arc Resistance, IPC TM-650 2.5.1
  • CTE, linear, IPC TM-650 2.4.41
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z direction
  • Specific Heat Capacity, ASTM E1461
  • Thermal Conductivity, ASTM D5470
  • Decomposition Temperature, IPC TM-650 2.4.24.6, Initial
  • Decomposition Temperature, IPC TM-650 2.4.24.6, 5 percent
  • Flammability, UL94
  
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