| Product Description: EPO-TEK® TZ101 is a single component, electrically insulating, thermally conductive epoxy adhesive designed for heatsinking of semiconductors, hybrids, electronics, and optics. Also available in a frozen syringe. Advantages & Application Notes: - Suggested Applications:
- Electronics:
- Bonding to Kapton flex PCB circuits.
- Adhesive for LCP packaging.
- Semiconductor:
- large IC die attach > 500 mil x 500 mil Si chips.
- Can be used as an underfill for flip chip mounted ICs, BGAs, and SMDs.
- Opto-electronics:
- Heat sinking laser diode chips in ceramic, hybrid or TO-can packaging.
- Bonding to thermally enhanced substrates such as aluminum nitride, Cu/W or Cu-plated BeO.
- White color after cure makes it attractive for LED, opto-coupler and x-ray scintillator circuits.
- Excellent damp heat resistance, via 85°C/85%RH.
- Excellent combination of stress relief and robustness.
Information Provided by Epoxy Technology |
