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Metal adhesives
Aptek 2313-PMF Hybrid Epoxy Adhesive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: Snap-cure, silver-filled; long pot-life/stable viscosity-excellent for robotics. Thermal shock resistant.

Production-oriented, snap-cure technology for surface mount applications-allows cure during solder reflow operation. High thixotropy/"tack" strength-holds components with minimal "Z" axis movement during cure. Stable viscosity for over 4 hours at RT-ideal for robotics. Low Tg (<-50°C) for excellent low temperature cycling and performance with minimal stress. Excellent substrate adhesion; superior to silicones: no primer required.

Information provided by Aptek Laboratories, Inc.

Vendors:
Available Properties
  • Density, ASTM D1475
  • Adhesive Bond Strength, Al-to-Al Lap Shear; Cured property; ASTM D1002
  • Volume Resistivity, Cured property; ASTM D257
  • Thermal Conductivity, COLORA
  • Glass Transition Temp, Tg, Cured property; Perkin Elmer TM-2
  • Flash Point, ASTM D92
  • Processing Temperature, Cure 120 min.
  • Processing Temperature, Cure 30 min.
  • Processing Temperature, Cure 30 sec; through solder reflow process
  
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Plastic

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Metal adhesives
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