Epoxy Technology EPO-TEK® H70E-175 Thermally Conductive Epoxy

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Epoxy Technology EPO-TEK® H70E-175 Thermally Conductive Epoxy
Categories:	Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive
Material Notes:	Product Description: EPO-TEK® H70E-175 is a two component, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic and opto-electronic packaging. It may be used in aluminum heat sinking power devices in the form of hybrid circuits or at the SMD/PCB level. Advantages & Application Notes: Semiconductor: die attaching chips to lead-frames or ceramic microcircuit substrates Hybrid packaging: dielectric and thermal adhesive for microwave and military circuits; reinforcing capacitor and resistor SMD attach PCB: bonding aluminum heat sinks; die-attaching IC’s via COB format Optical: heat sinking laser diodes and fiber optic components; adhesive for the optical bench Information Provided by Epoxy Technology
Vendors:

Available Properties

Specific Gravity, Part A
Specific Gravity, Part B
Particle Size
Viscosity, 20 rpm
Hardness, Shore D
Tensile Modulus, Storage
Shear Strength, Die
Shear Strength, Lap
Volume Resistivity
Dielectric Constant
CTE, linear, Below Tg
CTE, linear, Above Tg
Thermal Conductivity
Maximum Service Temperature, Air, Continuous
Maximum Service Temperature, Air, Intermittent
Minimum Service Temperature, Air, Continuous
Minimum Service Temperature, Air, Intermittent
Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
Decomposition Temperature, Degradation Temperature
Cure Time, Minimum Bond Line
Cure Time, Minimum Bond Line
Pot Life
Shelf Life

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

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