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Chemically Resistant adhesives
Cookson Group Plaskon® 3400FP Epoxy Molding Compound  (discontinued **)
Categories: Polymer; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: Test specimens were transfer molded and post cured 4 hours at 175°C.

A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs and medium lead count QFPs. Fast cycle times; Excellent moldability (ease of filling, good release, minimal flash and bleed and good hot hardness); Superior cosmetics; Improved markability; Minimal mold cleaning frequency

Vendors:
Available Properties
  • Density
  • Viscosity, Automatic orifice Viscosity
  • Spiral Flow, 177°C/1000 psi
  • Hardness, Shore D
  • Flexural Strength
  • Flexural Modulus
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • Arc Resistance
  • CTE, linear
  • CTE, linear, Transverse to Flow
  • Thermal Conductivity
  • Glass Transition Temp, Tg
  • Flammability, UL94
  • Flammability, UL94
  • Processing Temperature, Molding temperature
  
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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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Chemically Resistant adhesives
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