Key Features:- Very good temperature and chemical resistance
- Convenient handling
- Low shrinkage upon curing
- Outstanding dimensional stability
Product Description: Master Bond EP42HT-2LTE is an innovative, two component epoxy system with an ultra low coefficient of thermal expansion. It can be used as an adhesive, sealant, coating and, in some cases, as a casting system. EP42HT-2LTE has a forgiving 100 to 40 mix ratio by weight, or a 100 to 50 mix ratio by volume. After mixing, the consistency is that of a paste with some flow. It will cure at room temperature in 4-7 days or more quickly at elevated temperatures, e.g. 4-6 hours at 150-200°F. However, to optimize properties, the recommended cure is overnight at room temperature followed by 3-5 hours at 150-200°F. The mainstay property of this epoxy system is its exceptionally low coefficient of expansion of 9-12 x 10-6 in/in/°C. It has an array of other highly desirable properties including stellar electrical insulation, very good chemical resistance and unsurpassed dimensional stability. This epoxy will bond well to a wide variety of substrates, including metals, composites, ceramics, glass and many plastics. It is also noteworthy for its low linear (<0.01%) and volumetric (<0.1%) shrinkage. The latter property is particularly useful in potting and encapsulation applications. Also, the compound allows for precise alignment with minimal fixturing and simple curing. Its service temperature range is from -60°F to +300°F. The color of Part A is light cream and Part B is similar, but slightly darker. EP42HT-2LTE and its very special property profile allows it to be a desirable selection for the more challenging electronic, aerospace, optical and specialty OEM applications. EP42HT-2LTE passes NASA low outgassing tests and is recommended for applications involving vacuums, optics and other usages that require this important property. Product Advantages: - Non-critical 100 to 40 mix ratio by weight or 100 to 50 by volume
- Easy application: only contact pressure required while curing; adhesive spreads readily
- Highly reliable electrical insulator
- High degree of dimensional stability
- Desirably low shrinkage
- Extraordinarily low coefficient of thermal expansion
Information provided by Master Bond Inc. |
