Lord Adhesives CircuitSAF™ ME-456 Epoxy Dam Encapsulant

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Lord Adhesives CircuitSAF™ ME-456 Epoxy Dam Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	CircuitSAF™ ME-456 is a one component, high purity, fast cure, semiconductor grade epoxy encapsulant dam material developed for use in the encapsulation of wire bonded and flip devices where a dam in needed to restrict the flow of a cavity fill encapsulant. It has a high viscosity with a high thixotropic index that can be dispensed around the perimeter of the area to be encapsulated. Once CircuitSAF™ ME-456 has been dispensed, the area inside the dam can be encapsulated with Lord's Cavity Fill Encapsulant, CircuitSAF™ ME-455, and both materials can be cured at the same time. All information provided by Lord.
Vendors:

Available Properties
Specific Gravity Water Absorption Brookfield Viscosity, Spindle #7 @ 1rpm Modulus of Elasticity, DMA Dielectric Constant, ASTM D150-98 Dissipation Factor, ASTM D150-98 CTE, linear, ASTM D3386, Alpha 1 CTE, linear, ASTM D3386, Alpha 2 Glass Transition Temp, Tg, ASTM D3418, DSC Cure Time Pot Life Gel Time Shelf Life Potassium, K Sodium, Na

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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