| Product Description: EPO TEK® H74 is a two component, thermally conductive epoxy designed for hybrid circuit assembly including die attach, substrate attach, lid-seal, heat dissipation, and hermetic sealing in general. Advantages & Application Notes: - Suggested applications:
- Thixotropic paste allows for good handling characteristics. The epoxy can be dispensed, screen printed, or manually applied by toothpick or spatula.
- Outstanding high temperature properties and excellent solvent, chemical, and moisture resistance.
- Reasonable working life with fast curing at relatively low temperatures <120°C.
- Capable of providing a near-hermetic seal.
- Passes NASA low outgassing standard ASTM E595 with proper cure
- Built-in color indicator when the product is cured. This color change varies from a tan to brown, depending upon the curing conditions. It is normal for the epoxy to turn a very dark red when subjected to wire bonding temperatures.
- Used in opto-packaging for sealing 1) fiber into the snout; 2) a ferrule seal to the package; or 3) a boot to the package. Commonly used with DIP or Butterfly packages or TO-cans.
Information Provided by Epoxy Technology
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