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Master Bond adhesives
Solvay CYCOM® 754 Epoxy Resin with 36% - HS - 200 – 300; 70°C Cure
Categories: Polymer; Thermoset; Epoxy

Material Notes: Cycom® 754 has been developed to provide long out-life at ambient temperatures, combined with excellent mechanical properties generated at low cure temperatures. Cycom® 754 is a modified epoxy resin which has been specifically developed for versatile cures under vacuum only conditions; it can also be cured under pressure if required. The cure cycle can be adapted to suit the application, provided a full cure is eventually obtained – if a structure such as a hull needs to be cured in various stages, a partial cure can be done for the initial steps, provided the final laminate schedule undergoes a full cure cycle. This will not reduce the mechanical properties of the structure in any way. FM® 754 is an adhesive film that has been developed to co-cure with the Cycom® 754 prepregs. It can also be used for secondary bonding applications where necessary.

Features & Benefits:

  • Minimum 21 days out-life at ambient temperature
  • Versatile cure from 70°C (160°F) upwards, depending on application
  • Developed for vacuum only curing, but can also be cured under pressure
  • Excellent handling characteristics
  • Optimized flow and drape characteristics
  • Low density epoxy formulation
  • Available as unidirectional tape and fabric prepregs with a co-curable adhesive film
Cycom® 754 - 36% - HS - 200 – 300; Cure Cycle : 8 Hours at 70°C, no dwell

Information provided by Cytec, subsequently acquired by Solvay.

Vendors:
Available Properties
  • Flexural Strength, Cure cycle: 8 hrs at 70°C
  • Flexural Modulus, Cure cycle: 8 hrs at 70°C
  • Compressive Strength, Cure cycle: 8 hrs at 70°C
  • Shear Strength, Interlaminar, Cure cycle: 8 hrs at 70°C
  • Glass Transition Temp, Tg, Cure cycle: 8 hrs at 70°C
  • Cure Time
  
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Manufacturer Notes:
Solvay, former Rhodia Engineering Plastics

Category Notes
Plastic

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