Cookson Group Plaskon® SMT-B-1N Molding Compound for PBGAs

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Cookson Group Plaskon® SMT-B-1N Molding Compound for PBGAs (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy molding compound optimized specifically for PBGA applications with no plasma cleaning required before molding. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA and CSP applications. Features: Faster cure speed Improved wire sweep performance Lower viscosity No plasma cleaning required before molding Information provided by Cookson Electronics
Vendors:

Available Properties

Specific Gravity
Moisture Absorption at Equilibrium, at 85°C/85% RH, 168 hours
Viscosity, Automatic orifice, at 1000 psi
Spiral Flow, at 175°C and 1000 psi
Ash
Storage Temperature, Recommended
Hardness, Shore D, Cull hot
Flexural Strength
Flexural Strength
Flexural Modulus
Flexural Modulus
Volume Resistivity
Dielectric Constant
Dielectric Strength
Dissipation Factor
CTE, linear, Alpha 1
CTE, linear, Alpha 2
Thermal Conductivity
Glass Transition Temp, Tg
Flammability, UL94
Oxygen Index
Mold Temperature
Back Pressure
Cure Time, In mold
Cure Time, Post mold
Gel Time, Ram follower, at 175°C and 1000 psi
Shelf Life, at 35°C, <40% loss of spiral flow
Shelf Life, at 21°C, <40% loss of spiral flow
Shelf Life, at 5°C, <40% loss of spiral flow

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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