Park Aerospace Nelco® N4000-12 High Speed/Low Loss, CAF Resistant Laminate and Prepreg

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Park Aerospace Nelco® N4000-12 High Speed/Low Loss, CAF Resistant Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	The Nelco® N4000-12 series is an enhanced epoxy resin system designed for use in high speed, low loss applications requiring thermal stability, excellent signal speed and CAF resistance. Key Features and Benefits: Lead-Free Assembly Compatible Tg >190ºC, robust thermal stability High Speed and Low Loss Properties CAF Resistant SI (Signal Integrity) option High-Tg FR-4 processing Applications/Qualifications: Lead-Free Assemblies Fine-Line Multilayers Backplanes Surface-Mount Multilayers BGA Multilayers SIPs MCM-Ls Direct Chip Attach Network Storage Wireless Communications Infrastructure High Speed Computing Information provided by Park Electrochemical Corp.
Key Words:	EP
Vendors:

Available Properties

Density, 50% Resin Content; Internal Method
Water Absorption, IPC-TM-650.2.6.2.1
Modulus of Elasticity, ASTM D3039, Y
Modulus of Elasticity, ASTM D3039, X
Poissons Ratio, ASTM D3039, Y
Poissons Ratio, ASTM D3039, X
Peel Strength, IPC-TM-650.2.4.8.2a, at elevated temperature
Peel Strength, IPC-TM-650.2.4.8, after solder float
Peel Strength, IPC-TM-650.2.4.8, after exposure to process solutions
Volume Resistivity, IPC-TM-650.2.5.17.1, E - 24/125
Volume Resistivity, IPC-TM-650.2.5.17.1, C - 96/35/90
Surface Resistance, IPC-TM-650.2.5.17.1, E - 24/125
Surface Resistance, IPC-TM-650.2.5.17.1, C - 96/35/90
Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
Dielectric Constant, Split Post Cavity
Dielectric Constant, IPC-TM-650.2.5.5.9, RF Impedance
Dielectric Strength, IPC-TM-650.2.5.6.2
Dielectric Breakdown, IPC-TM-650.2.5.6
Dissipation Factor, Split Post Cavity
Dissipation Factor, Split Post Cavity
Arc Resistance, IPC-TM-650.2.5.1
CTE, linear, IPC-TM-650.2.4.41, X/Y
CTE, linear, IPC-TM-650.2.4.41, Z-Axis Alpha 1
CTE, linear, IPC-TM-650.2.4.41, Z-Axis Alpha 2
Specific Heat Capacity, ASTM E1461
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
Glass Transition Temp, Tg, IPC-TM-650.2.4.24.3, DMA (Tan d Peak)
Decomposition Temperature, IPC-TM-650.2.4.24.6, 5% weight loss; TGA
Flammability, UL94

Property Data

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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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