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Chemically Resistant adhesives
Lord Adhesives Gelease™ MG-100 Thermally Conductive Silicone Gel Interface
Categories: Fluid; Lubricant; Silicone Base; Silicone, Filled Grease

Material Notes: Gelease™ MG-100 is a one-component thermally conductive silicone gel interface material that exhibits the low thermal resistance properties of a grease while possessing the integrity of a gel. The Gelease™ formulation is designed to provide the most efficient heat transfer from Flip Chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components. The crosslinked structure of Gelease™ MG-100 inhibits bleed, separation, and pump-out that are typically observed in many thermal interface materials.

All information provided by Lord.

Vendors:
Available Properties
  • Specific Gravity, ASTM D1505
  • Viscosity, 10rpm
  • Viscosity, 1rpm
  • Modulus of Elasticity
  • Volume Resistivity, ASTM D257
  • Dielectric Constant, ASTM D150
  • Dielectric Constant, ASTM D150
  • Dielectric Constant, ASTM D150
  • Dielectric Constant, ASTM D150
  • Dielectric Constant, ASTM D150
  • Dissipation Factor, ASTM D150
  • Dissipation Factor, ASTM D150
  • Dissipation Factor, ASTM D150
  • Dissipation Factor, ASTM D150
  • Dissipation Factor, ASTM D150
  • Thermal Conductivity, ASTM F433
  • Maximum Service Temperature, Air
  • Glass Transition Temp, Tg, ASTM D3386
  • Cure Time
  • Cure Time
  • Pot Life
  • Shelf Life
  
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Chemically Resistant adhesives
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