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Flame Retardant adhesives
Cookson Group Plaskon® SMT-B-2HS Molding Compound for Heat Spreader Applications  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: This material is an epoxy molding compound for high temperature, lead-free reflow. It is designed to withstand more demanding requirements in moisture performance, occasioned by the higher IR reflow temperatures required for processing lead-free packages. It is a highly filled, multifunctional resin designed to pass JEDEC Level 3 at 220°C IR reflow temperatures.

Features:

  • Lower moisture pickup
  • Excellent moldability
  • High glass transition temperature
  • Fast cure

Information provided by Cookson Electronics

Vendors:
Available Properties
  • Specific Gravity
  • Moisture Absorption at Equilibrium, at 85°C/85% RH, 168 hours
  • Viscosity, Shimadzu Viscosity, 1000 psi
  • Spiral Flow, at 175°C and 1000 psi
  • Ash
  • Storage Temperature, Recommended
  • Hardness, Shore D, Cull hot
  • Flexural Strength
  • Flexural Strength
  • Flexural Modulus
  • Flexural Modulus
  • Volume Resistivity
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • CTE, linear, Alpha 1
  • CTE, linear, Alpha 2
  • Thermal Conductivity
  • Glass Transition Temp, Tg
  • Flammability, UL94
  • Mold Temperature
  • Back Pressure
  • Cure Time, In mold
  • Cure Time, Post mold
  • Gel Time, Ram follower, at 175°C and 1000 psi
  • Shelf Life, at 35°C, <40% loss of spiral flow
  • Shelf Life, at 22°C, <40% loss of spiral flow
  • Shelf Life, at 5°C, <40% loss of spiral flow
  
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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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Flame Retardant adhesives
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