Rogers Arlon CLTE Microwave Printed Circuit Board Substrate

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Rogers Arlon CLTE Microwave Printed Circuit Board Substrate
Categories:	Polymer; Thermoplastic; Fluoropolymer; Polytetrafluoroethylene (PTFE)
Material Notes:	CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98. Ceramic/PTFE composite Low water absorption High thermal conductivity Low loss Tight Dk and Thickness tolerance Benefits: Thermally stable Dk and Df Dimensional stability Typical Applications: Radar Manifolds Phased Array Antennas Microwave Feed Networks Phase Sensitive Electric Structures PAs, LNAs, LNBs Satellite & Space Electronics Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors:

Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Outgassing - Total Mass Loss, NASA SP-R-0022A, Water Vapor Recovered
Outgassing - Total Mass Loss, NASA SP-R-0022A
Collected Volatile Condensable Material, NASA SP-R-0022A
Tensile Strength, IPC TM-650 2.4.18.3, Cross
Tensile Strength, IPC TM-650 2.4.18.3, Machine
Modulus of Elasticity, IPC TM-650 2.4.18.3
Flexural Strength, IPC TM-650 2.4.4, Cross
Flexural Strength, IPC TM-650 2.4.4, Machine
Compressive Modulus, ASTM D3410
Poissons Ratio, ASTM D3039
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Dielectric Constant, varies by thickness
Dielectric Constant, IPC TM-650 2.5.5.3, may vary by thickness
Dielectric Constant, IPC TM-650 2.5.5.5, may vary by thickness
Dielectric Strength, IPC TM-650 2.5.6.2
Dielectric Breakdown, IPC TM-650 2.5.6
Dissipation Factor
Dissipation Factor
Dissipation Factor, IPC TM-650 2.5.5.3
Dissipation Factor, IPC TM-650 2.5.5.5
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41, x direction
CTE, linear, IPC TM-650 2.4.41, y direction
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z direction
Thermal Conductivity, ASTM E1461
Decomposition Temperature, IPC TM-650 2.4.24.6, Onset
Decomposition Temperature, IPC TM-650 2.4.24.6, 5 percent
Flammability, UL94

Property Data

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Category Notes
Plastic

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