COB/DCA Encapsulants are essential to the reliability of flip chip assemblies because they minimize the thermal mismatch between the flip chip and substrate.Loctite® Underfills and Encapsulants improve assembly operations by providing superior reliability and faster throughput. Improved reliability is achieved through products that have a high Tg, low CTE, high throughput and excellent adhesion. Faster throughput and higher yields are achieved through faster flow characteristics and increased cure speeds.
Loctite® 3566 Rapid Flow Low Profile Underfill
An extremely fast flowing, rapid cure underfill for industrial and consumer flip chip applications. Withstands operating temperatures up to 125°C. |
