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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.
Epoxy Technology EPO-TEK® 377 High Temperature Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, High Temperature

Material Notes: Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications.

Advantages & Application Notes:

  • Low viscosity epoxy with excellent handling characteristics. It can be used for encapsulating or potting. It may be applied by hand, pouring, spin coating, brushing, dipping, or automated dispensers.
  • Complies with USP Class VI biocompatibility standards.
  • Passes NASA low outgassing standard ASTM E595 with proper cure
  • Suggested Medical Applications / Scientific OEM:
    • Potting fiber ferrules for endoscopes
    • Outstanding high temperature properties at 300°C and excellent solvent, chemical and moisture resistance, including autoclave, ETO, and gamma radiation
  • Suggested Semiconductor Grade epoxy
  • Spin coating at wafer level for MEMS fabrication of pressure sensors and accelerometers
  • Wafer-to-wafer bonding in CSP
  • Capillary underfill of flip chip packaged die
  • Suggested Optical grade epoxy, opto-electronic packaging
  • Transmission in NIR from 700 – 900 nm >95%
  • Glass seal, hermetic seal of glass plates in LCD fabrication
  • Hermetic seal of IR-filter window to aluminum cap of TO-Can in hybrid packaged IR sensors.
  • Suggested Industrial: resist salt water, hydraulic fluids, motor oil, alcohol, 10% nitric acid, 10% sulfuric acid, 10% ammonia solution and most solvents.

    Information Provided by Epoxy Technology

  • Vendors:
    Available Properties
    • Specific Gravity, Part A
    • Specific Gravity, Part B
    • Viscosity, 100 rpm
    • Ionic Impurities - Na (Sodium)
    • Ionic Impurities - K (Potassium)
    • Ionic Impurities - Cl (Chloride)
    • Hardness, Shore D
    • Tensile Modulus, Storage
    • Shear Strength, Lap
    • Shear Strength, Die
    • Volume Resistivity
    • Dielectric Constant
    • Dissipation Factor
    • CTE, linear, Below Tg
    • CTE, linear, Above Tg
    • Maximum Service Temperature, Air, Continuous
    • Maximum Service Temperature, Air, Intermittent
    • Minimum Service Temperature, Air, Continuous
    • Minimum Service Temperature, Air, Intermittent
    • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
    • Decomposition Temperature, Degradation Temperature
    • Refractive Index
    • Transmission, Visible, Spectral
    • Transmission, Visible, Spectral
    • Cure Time, Minimum Bond Line
    • Pot Life
    • Shelf Life
    • USP Class VI
      
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    Manufacturer Notes:
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    Category Notes
    Plastic

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    USP Class VI Adhesives
    USP Class VI Approved Adhesives for Medical Device Applications
    Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.
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