Product Description: EPO TEK®377 is a two component, high Tg, fiber optic grade epoxy adhesive. It is well suited for semiconductor, medical and optical applications. Advantages & Application Notes: - Low viscosity epoxy with excellent handling characteristics. It can be used for encapsulating or potting. It may be applied by hand, pouring, spin coating, brushing, dipping, or automated dispensers.
- Complies with USP Class VI biocompatibility standards.
- Passes NASA low outgassing standard ASTM E595 with proper cure
- Suggested Medical Applications / Scientific OEM:
- Potting fiber ferrules for endoscopes
- Outstanding high temperature properties at 300°C and excellent solvent, chemical and moisture resistance, including autoclave, ETO, and gamma radiation
- Suggested Semiconductor Grade epoxy
- Spin coating at wafer level for MEMS fabrication of pressure sensors and accelerometers
- Wafer-to-wafer bonding in CSP
- Capillary underfill of flip chip packaged die
Suggested Optical grade epoxy, opto-electronic packagingTransmission in NIR from 700 – 900 nm >95%Glass seal, hermetic seal of glass plates in LCD fabricationHermetic seal of IR-filter window to aluminum cap of TO-Can in hybrid packaged IR sensors.Suggested Industrial: resist salt water, hydraulic fluids, motor oil, alcohol, 10% nitric acid, 10% sulfuric acid, 10% ammonia solution and most solvents.Information Provided by Epoxy Technology |