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Flame Retardant adhesives
Cookson Group Plaskon® SMT-B-1FX Molding Compound for PBGAs  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: This material is an epoxy molding compound optimized specifically for PBGA applications. It is a reduced catalyst version of SMT-B-1F and provides a 1-2% wire sweep improvement in most applications. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA applications.

Features:

  • Faster cure speed
  • Improved wire sweep performance
  • Improved warp performance
  • High HSTL performance
  • Lower viscosity
  • Reduced cure time

Information provided by Cookson Electronics

Vendors:
Available Properties
  • Specific Gravity
  • Viscosity, Automatic orifice Viscosity
  • Spiral Flow, at 175°C and 1000 psi
  • Ash
  • Storage Temperature, Recommended
  • Hardness, Shore D, Cull hot, 75 sec @ 175°C
  • Flexural Strength
  • Flexural Strength
  • Flexural Modulus
  • Flexural Modulus
  • Volume Resistivity
  • Dielectric Constant
  • Dielectric Strength
  • Dissipation Factor
  • CTE, linear, Alpha 1
  • CTE, linear, Alpha 2
  • Thermal Conductivity
  • Glass Transition Temp, Tg
  • Flammability, UL94
  • Oxygen Index
  • Mold Temperature
  • Back Pressure
  • Cycle Time - Injection
  • Cure Time, Post mold
  • Gel Time, Ram follower, at 175°C and 1000 psi
  • Shelf Life, at 35°C, <40% loss of spiral flow
  • Shelf Life, at 21°C, <40% loss of spiral flow
  • Shelf Life, at 5°C, <40% loss of spiral flow
  
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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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Flame Retardant adhesives
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