Park Aerospace Nelco® N4000-7 SI® FR-4 Epoxy Laminate and Prepreg

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Park Aerospace Nelco® N4000-7 SI® FR-4 Epoxy Laminate and Prepreg
Categories:	Polymer; Thermoset; Epoxy
Material Notes:	The Nelco® N4000-7 low-CTE epoxy laminate and prepreg system is a cost-effective solution for use in a broad range of multilayer PCB designs requiring low Z-axis expansion, excellent thermal stability and superior hole-wall integrity. Key Features and Benefits: Outstanding Z-axis, thermal stability and hole wall integrity Automotive Testing SI (Signal Integrity) option CAF resistant Cost-effective standard FR-4 processing Applications/Qualifications: Wireless Handsets Wireless Infrastructure Digital Broadband Multilayers Automotive Underhood Automotive Backplanes Fine-Line Multilayers Fine Pitch BGA Multilayers Direct Chip Attach RoHS Compliant Meets IPC-4101/98 Specifications Information provided by Park Electrochemical Corp.
Key Words:	EP
Vendors:

Available Properties

Density, 50% Resin Content; Internal Method
Water Absorption, IPC-TM-650.2.6.2.1
Peel Strength, IPC-TM-650.2.4.8, after solder float
Peel Strength, IPC-TM-650.2.4.8.2a, at elevated temperature
Peel Strength, IPC-TM-650.2.4.8, after exposure to process solutions
Volume Resistivity, IPC-TM-650.2.5.17.1, E - 24/125
Volume Resistivity, IPC-TM-650.2.5.17.1, C - 96/35/90
Surface Resistance, IPC-TM-650.2.5.17.1, E - 24/125
Surface Resistance, IPC-TM-650.2.5.17.1, C - 96/35/90
Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
Dielectric Constant, IPC-TM-650.2.5.5.5, Stripline
Dielectric Constant, IPC-TM-650.2.5.5.9, RF Impedance
Dielectric Constant, IPC-TM-650.2.5.5.3, TFC/LCR Meter
Dielectric Strength, IPC-TM-650.2.5.6.2
Dielectric Breakdown, IPC-TM-650.2.5.6
Dissipation Factor, IPC-TM-650.2.5.5.5, Stripline
Dissipation Factor, IPC-TM-650.2.5.5.5, Stripline
Dissipation Factor, IPC-TM-650.2.5.5.3, TFC/LCR Meter
Arc Resistance, IPC-TM-650.2.5.1
CTE, linear, IPC-TM-650.2.4.41, X/Y
CTE, linear, IPC-TM-650.2.4.41, Z-Axis Alpha 1
CTE, linear, IPC-TM-650.2.4.41, Z-Axis Alpha 2
Specific Heat Capacity, ASTM E1461
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
Glass Transition Temp, Tg, IPC-TM-650.2.4.24.3, DMA (Tan d Peak)
Decomposition Temperature, IPC-TM-650.2.4.24.6, 5% weight loss; TGA
Flammability, UL94

Property Data

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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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