Product Highlights:- Very high thermal conductivity
- Low coefficient of thermal expansion
- Superior dimensional stability
- Outstanding physical strength properties
- Exceptional electrical insulation properties
- Very good flowability
Kohesi Bond KB 1040 AOHT is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. It offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. Rapid cures are achievable with a straight heat cure as well at elevated temperatures. KB 1040 AOHT offers an extensive service temperature range of -50°C to +200°C. It offers outstanding physical strength properties and dimensional stability. It offers first-rate compressive strength of over 20,000 psi at room temperature. KB 1040 AOHT adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. It offers excellent chemical resistance to a variety of solvents, oils and water. Part A has an off-white color and Part B has a clear color. Owing to its high thermal conductivity and very low CTE, KB 1040 AOHT is widely used in electronics, aerospace, optical, semiconductor and various OEM applications Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
