| STAYCHIP™ 3083 is specially formulated to minimize warpage and thermal stress within the die and at the underfill-die interface, which otherwise could initiate defects such as die cracking, fillet cracking and delamination. The low CTE and high strength & toughness of STAYCHIP™ 3083 provide excellent solder-joint protection during thermal cycling, while its superior adhesion to common solder-mask and die passivation surfaces (even after exposure to elevated heat, pressure, and humidity), ensure exceptional JEDEC performance. The fast flow characteristics are designed for penetration of gaps below 1mil. Features: - Low Stress & Warpage
- Passes JEDEC L3/ 3 x 260°C on a variety of die (up to 20 mm x 20 mm) and substrates
- Low CTE for Excellent Reliability in Thermal Cycling
- Exceptional Adhesion (even after exposure to high humidity, pressure, and temperature)
- Fast, Efficient Flow Properties
- Small particle size filler for use on fine pitch array packages
Information provided by Cookson Electronics |
