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Master Bond adhesives
Rogers Corporation 2929 Bondply Unreinforced, Hydrocarbon based Thin Film Adhesive System
Categories: Polymer; Adhesive

Material Notes:
  • Low dielectric constant and loss tangent
  • Ideal for multi-layer bonding
  • Compatible with traditional processing methods
  • Compatible with a broad range of material types including PTFE composites
  • Reliable through sequential bonding
  • Can be tack bonded to inner-layer surfaces prior to machining cut-outs
  • Excellent blind via fill capability
  • Predictable control of post-bond thickness
  • Lead-Free process compatible
  • Color: White

Typical Applications:

  • Automotive Radar and Sensors
  • Point-to point Microwave
  • Base Station Antennas
  • Power Amplifiers
  • Phased Array Radar
  • RF Components
  • Patch Antennas
  • Power Backplanes

Information provided by Rogers Corporation.

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Moisture Absorption at Equilibrium, ASTM D570, D24/23
  • Outgassing - Total Mass Loss, ASTM E595, WVR
  • Outgassing - Total Mass Loss, ASTM E595, TML
  • Collected Volatile Condensable Material, ASTM E595
  • Peel Strength, IPC-TM-650 2.4.8, Copper; X- and Y-Directions; 1/2 oz. EDC Post Solder
  • Dielectric Constant, IPC-TM-650 2.5.5.5.1, Z Direction
  • Dielectric Strength, IPC-TM-650 2.5.6.2, Z Direction, 50% RH
  • Dissipation Factor, IPC-TM-650 2.5.5.5
  • CTE, linear, IPC-TM-650 2.4.41, X-Direction
  • CTE, linear, IPC-TM-650 2.4.41, Y-Direction
  • CTE, linear, IPC-TM-650 2.4.41, Z-Direction
  • Thermal Conductivity, ASTM C518, Z Direction
  • Glass Transition Temp, Tg, IPC-TM-650 2.4.24, DMA Method
  • Decomposition Temperature, ASTM D3850, TGA 5% WT
  
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Manufacturer Notes:
none

Category Notes
Plastic

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