Product Highlights:- Superior optical clarity
- Excellent flow properties
- First-rate flexibility
- Very low exotherm, ideal for casting
- Exceptional electrical insulation properties
- Resists mechanical and thermal shocks
Kohesi Bond KB 1048 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This epoxy system offers excellent flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C - 90°C for 3 - 5 hours. KB 1048 FL is optically clear and offers top notch light transmissions properties. It offers an extensive service temperature range of -73°C to +120°C. This adhesive fosters outstanding resistance to mechanical and thermal shocks. It is a 100% solids system, offering minimal shrinkage upon cure. KB 1048 FL adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers lower exotherm, making it ideal for stress free bonding. Part A is clear in color and Part B is amber clear in color. KB 1048 FL is widely used in optical, optoelectronic, fiber-optic, electronics and related industries especially where optical clarity and high flexibility are desired. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
