Cookson Group Plaskon® S-7S Epoxy Encapsulant

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Cookson Group Plaskon® S-7S Epoxy Encapsulant (discontinued **)
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	Test specimens were transfer molded and post cured 4 hours at 175°C. A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically formulated to provide a lower viscosity for those low stress applications where wire sweep may be a concern. Excellent low stress properties; Consistent moldability (low viscosity, easy of mold filling, fast cycles and good hot hardness); Outstanding cosmetics and markability; Superior reliability
Vendors:

Available Properties

Density
Viscosity, Automatic orifice Viscosity
Linear Mold Shrinkage
Spiral Flow, 177°C/1000 psi
Hardness, Shore D
Tensile Strength, Ultimate
Flexural Strength
Flexural Modulus
Dielectric Constant
Dielectric Strength
Dissipation Factor
Arc Resistance
CTE, linear
CTE, linear, Transverse to Flow
Thermal Conductivity
Glass Transition Temp, Tg
Flammability, UL94
Flammability, UL94
Processing Temperature, Molding temperature

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
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