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Chemically Resistant adhesives
Rogers Corporation RO4003C Glass-Reinforced Hydrocarbon and Ceramic Laminate with Thin Film Resistor Foil
Categories: Ceramic; Ceramic Matrix Composite

Material Notes: RO4000® Series High Frequency Circuit Materials are glass-reinforced hydrocarbon and ceramic (not PTFE) laminates with TICER™ TCR® Thin Film Resistor Foils. These laminates are designed for performance sensitive, high volume commercial applications. RO4000 laminates are designed to offer superior high frequency performance and low-cost circuit fabrication. The result is a low loss material which can be fabricated using standard epoxy/glass (FR4) processes.

Features and Benefits:

  • Glass-reinforced hydrocarbon and ceramic dielectric
  • Volume manufacturing process
  • Excellent high-frequency performance
  • Low Z-axis expansion, excellent dimensional stability
  • Integrated thin film resistor benefits
  • Foils available in 25, 50 and 100 OPS NiCr
  • Foils offered in 1/2 ounce copper weight
  • Lead-Free process compatible

Typical Applications:

  • Global communications systems
  • High reliability and complex multilayer circuits
  • Wireless communication devices

Information provided by Rogers Corporation.

Vendors:
Available Properties
  • Density, ASTM D792
  • Moisture Absorption at Equilibrium, ASTM D570, Immersion; 0.06 in thick
  • Thickness, Range of Thicknesses Available
  • Tensile Strength, ASTM D638, RT, Y direction
  • Tensile Modulus, ASTM D638, RT, Y direction
  • Flexural Strength, IPC-TM-650, 2.4.4
  • Peel Strength, IPC-TM-650 2.4.8, Copper, After Solder Float, 1/2 ounce TCR Foil
  • Volume Resistivity, IPC 2.5.17.1, Cond. A
  • Surface Resistance, IPC 2.5.17.1, Cond. A
  • Dielectric Constant, IPC-TM-650 2.5.5.6, Design Spec., FSR, Z-direction
  • Dielectric Constant, IPC-TM-650 2.5.5.5, Process, Clamped stripline, Z-direction
  • Dielectric Strength, IPC-TM-650 2.5.6.2, Z Direction
  • Dissipation Factor, IPC-TM-650 2.5.5.5
  • Dissipation Factor, IPC-TM-650 2.5.5.5
  • CTE, linear, IPC-TM-650 2.4.41, X-Direction
  • CTE, linear, IPC-TM-650 2.4.41, Y-Direction
  • CTE, linear, IPC-TM-650 2.4.41, Z-Direction
  • Thermal Conductivity, ASTM C518
  • Glass Transition Temp, Tg, IPC-TM-650 2.4.24, Condition A
  • Decomposition Temperature, ASTM D3850, TGA
  
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Chemically Resistant adhesives
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