Cookson Group Plaskon® ALP-2 (188.pcs03) Thin Package Encapsulant

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Cookson Group Plaskon® ALP-2 (188.pcs03) Thin Package Encapsulant (discontinued **)
Categories:	Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound
Material Notes:	This material is an epoxy encapsulant for high productivity packaging of very thin, stress-sensitive devices such as TSSOP’s. Performance attributes are intended to meet or exceed JEDEC Level 1 for all packages and have no or limited post-mold cure, fast cure cycle times tailored to specific applications and excellent adhesion to Cu and Pd-Ni leadframes. Features: Very low moisture pickup Good moldability Good markability Fast cure Outstanding device reliability Information provided by Cookson Electronics
Vendors:

Available Properties

Specific Gravity
Moisture Absorption at Equilibrium, at 85°C/85% RH, 168 hours
Viscosity, Shimadzu Viscosity, 1000 psi
Spiral Flow, at 175°C and 1000 psi
Ash
Storage Temperature, Recommended
Hardness, Shore D, Cull hot
Flexural Strength
Flexural Strength
Flexural Modulus
Flexural Modulus
Volume Resistivity
Volume Resistivity
Dielectric Constant
Dielectric Strength
CTE, linear, Alpha 1
CTE, linear, Alpha 2
Thermal Conductivity
Glass Transition Temp, Tg
Flammability, UL94
Mold Temperature
Back Pressure
Cure Time
Cure Time, Post mold
Gel Time, Ram follower, at 175°C and 1000 psi
Shelf Life, at 35°C, <40% loss of spiral flow
Shelf Life, at 22°C, <40% loss of spiral flow
Shelf Life, at 5°C, <40% loss of spiral flow

Property Data

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Manufacturer Notes:
none

Category Notes
Plastic

**
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