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LECO for Empowering Results
Solvay FM® 2555 Ester Film Adhesive
Categories: Polymer; Thermoset; Polyester, TS

Material Notes: Description: FM® 2555 is a 350°F (177°C) cure, 440°F (227°C) post-cure modified cyanate ester film adhesive. This adhesive has good high temperature properties with low dielectric constant and low loss tangent electrical properties. Other products in this cyanate ester family include CYCOM® 5575-2 glass- and quartz- reinforced prepreg, FM® 2525 adhesive and FM® 6555-1 and BR® 6565 syntactic foams.

Features & Benefits:

  • One of a family of compatible products based on second-generation cyanate ester chemistry
  • Low dielectric constant and loss tangent for radome applications
  • Suitable for bonding both metals and composites; co-cures with most 350°F (177°C) cure prepregs
  • Service temperature -67° to 450°F (-55° to 232°C); good high temperature adhesion
  • Low out-gassing
Applications:
  • Honeycomb sandwich construction
  • Metal-to-metal bonding
  • Composite-to-metal bonding
  • Composite-to-composite bonding
  • 350°F (177°C) cure satellite structure applications
Note 1: CYCOM® 5575-2/7781 HRH-10 core 4 lb. density 3/16 inch cell 1 inch thick Co-cure

Note 2: CYCOM® 5575-2/7781 HRH-10 core 6 lb. density 3/16 inch cell 1 inch thick Co-cure

Note 3: CYCOM® 5575-2/7781 HRP core 4 lb. density 3/16 inch cell 1 inch thick Co-cure

Note 4: CYCOM® 5575-2/7781 HRP core 8 lb. density 3/16 inch cell 1 inch thick Co-cure

Note 5: CYCOM® 5575-2/7781 HRH-327 core 4 lb. density 3/16 inch cell 1 inch thick Co-cure

Information provided by Cytec, subsequently acquired by Solvay.

Vendors:
Available Properties
  • Volatiles
  • Water Absorption, ASTM E595
  • Outgassing - Total Mass Loss, ASTM E595
  • Collected Volatile Condensable Material, ASTM E595
  • Tensile Strength, Flatwise, Note 1, Core failure
  • Tensile Strength, Flatwise, Note 5, Core failure
  • Tensile Strength, Flatwise, Note 2, Core failure
  • Tensile Strength, Flatwise, Note 3, Cohesive failure
  • Tensile Strength, Flatwise, Note 4, Cohesive failure
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 500 hours at 350°F (177°C)
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 3000 hours at 350°F (177°C)
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 3000 hours at 350°F (177°C)
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 500 hours at 350°F (177°C)
  • Tensile Strength, Flatwise, Metal skins-to-honeycomb core
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 1000 hours at 350°F (177°C)
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 3000 hours at 350°F (177°C)
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 1000 hours at 350°F (177°C)
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 1000 hours at 350°F (177°C)
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch, Conditioning: 500 hours at 350°F (177°C)
  • Tensile Strength, Flatwise, Metal skins-to-honeycomb core
  • Tensile Strength, Flatwise, Metal skins-to-honeycomb core
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch
  • Tensile Strength, Flatwise, Metal skins-to-honeycomb core
  • Tensile Strength, Flatwise, Metal-to-metal bonding FPL etch
  • Tensile Strength, Flatwise, Metal skins-to-honeycomb core
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 3000 hours at 350°F (177°C)
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 3000 hours at 350°F (177°C)
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
  • Adhesive Bond Strength, Lap, CYCOM® 5208/3K70PW
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 3000 hours at 350°F (177°C)
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
  • Adhesive Bond Strength, Lap, wet, CYCOM® 5250-3/3781
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
  • Adhesive Bond Strength, Lap, CYCOM® 5208/3K70PW
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 72 hour water boil
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days at 95% RH, 160°F (71°C)
  • Adhesive Bond Strength, Lap, wet, CYCOM® 5250-3/3781
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
  • Adhesive Bond Strength, Lap, wet, CYCOM® 5250-3/3781
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch
  • Adhesive Bond Strength, Lap, CYCOM® 5575-2/7781
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
  • Adhesive Bond Strength, Lap, CYCOM® 5250-3/3781
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 1000 hours at 350°F (177°C)
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days at 95% RH, 160°F (71°C)
  • Adhesive Bond Strength, Lap, CYCOM® 5250-3/3781
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 1000 hours at 350°F (177°C)
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days 5% salt spray at 95°F (35°C)
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days 5% salt spray at 95°F (35°C)
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 1000 hours at 350°F (177°C)
  • Adhesive Bond Strength, Lap, CYCOM® 5575-2/7781
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days hydraulic oil
  • Adhesive Bond Strength, Lap, CYCOM® 5250-3/3781
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 72 hour water boil
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days 5% salt spray at 95°F (35°C)
  • Adhesive Bond Strength, Lap, Metal-to-Metal, 2024/T3 FPL etch Phosphoric acid anodize
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days JP4
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 500 hours at 350°F (177°C)
  • Adhesive Bond Strength, Lap, CYCOM® 5250-3/3781
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 500 hours at 350°F (177°C)
  • Adhesive Bond Strength, Lap, CYCOM® 5208/3K70PW
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 72 hour water boil
  • Adhesive Bond Strength, Lap, CYCOM® 5575-2/7781
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days hydraulic oil
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days JP4
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days hydraulic oil
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 7 days JP4
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 30 days at 95% RH, 160°F (71°C)
  • Adhesive Bond Strength, Lap, CYCOM® 5575-2/7781
  • Adhesive Bond Strength, Lap, Metal-to-metal bonding 2024/T3, FPL etch, Conditioning: 500 hours at 350°F (177°C)
  • Dielectric Constant
  • Dielectric Constant
  • Dielectric Loss Index
  • Dielectric Loss Index
  • CTE, linear, without post-cure
  • CTE, linear, with post-cure
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Glass Transition Temp, Tg, dry
  • Processing Temperature, Recommended Cure
  • Processing Temperature, Recommended Post-Cure
  • Gel Time
  • Gel Time
  • Gel Time
  • Shelf Life
  • Shelf Life
  • Shelf Life
  
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Manufacturer Notes:
Solvay, former Rhodia Engineering Plastics

Category Notes
Plastic

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