• Low dielectric loss
• Excellent mechanical properties versus temperature - reliable stripline and multi-layer board constructions.
• Uniform mechanical properties- ideal for multi-layer board designs with a range of dielectric constants and suitable for use with epoxy glass multi-layer board hybrid designs.
• Low in-plane expansion coefficient (match to copper) - allows for more reliable surface mounted assemblies, ideal for applications sensitive to temperature change and excellent dimensional stability
• Stable dielectric constant versus temperature and frequency - Ideal for band pass filters, microstrip patch antennas and voltage controlled oscillators
• High thermal conductivity - Lower operating temperature and increased reliability in power amplifier applications
• Lead-free process compatible

Uses:

• Commercial microwave applications
• RF applications

Information provided by Rogers Corporation.