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Chemically Resistant adhesives
Resin Technology Group TIGA 908 Gold Bonder - Low Stress Silver Conductive
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Adhesive

Material Notes: 100 parts resin to 6 parts hardener.

TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gold, high stress absorption, conductivity, and mechanical performance. This smooth paste formulation of pure silver and epoxy is free of solvents and extraneous additives. It develops strong, durable, electrically and thermally conductive bonds between many dissimilar materials including gold and other metals, ceramics and plastic laminates.

Information provided by Resin Technology Group.

Vendors:
Available Properties
  • Specific Gravity
  • Solids Content, Reactive
  • Hardness, Shore D
  • Shear Strength, Cured 1 hour at 125°C, Al/Al
  • Shear Strength, Cured 30 minutes at 150°C, Al/Al
  • Shear Strength, Cured 1 hour at 125°C, Au/Au
  • Shear Strength, Cured 30 minutes at 150°C, Au/Au
  • Shear Strength, Cured 2 hours at 125°C, Al/Al
  • Shear Strength, Cured 2 hours at 125°C, Au/Au
  • Volume Resistivity, cured 2 hours at 125°C
  • Volume Resistivity, cured 30 minutes at 150°C
  • Volume Resistivity, cured 1 hour at 125°C
  • Volume Resistivity, cured 4 hours at 65°C
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Pot Life
  
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Manufacturer Notes:
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Category Notes
Plastic

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Chemically Resistant adhesives
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