100 parts resin to 6 parts hardener. TIGA 908 is a low stress, conductive silver filled epoxy adhesive. It is recommended for bonding, and sealing electronic applications which require bonding to gold, high stress absorption, conductivity, and mechanical performance. This smooth paste formulation of pure silver and epoxy is free of solvents and extraneous additives. It develops strong, durable, electrically and thermally conductive bonds between many dissimilar materials including gold and other metals, ceramics and plastic laminates. Information provided by Resin Technology Group. |