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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.
Epoxy Technology EPO-TEK® 375 High Temperature Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, High Temperature

Material Notes: Product Description: EPO-TEK®375 is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. Also available in a single component frozen syringe.

Advantages & Application Notes:

  • Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.
  • Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
  • Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices and resisting high temperature packaging.
    • Down-hole petrochemical fiber optic sensors resisting >200°C field conditions.
  • Fiber optic adhesive suggested applications:
    • Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range.
    • Fiber component packaging, adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays.
  • Medical suggested applications:
    • Potting fiber optic bundles into ferrules for light guides and endoscopes; capable of resisting several sterilization techniques including ETO, gamma, ION beam, H202 plasma, and >200 autoclave steam cycles; excellent adhesion to surfaces including stainless steel, diamond, titanium, brass, ceramics, glass and most plastics.
    • Certified to USP Class VI Biocompatibility Standards for medical implants; adhesive for catheter devices including stents and guide wires.
  • Electronics Assembly suggested applications:
    • Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices.
    • Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
    • Structural grade epoxy found in hard-disk drive devices; bonding of stainless steel metals, kapton, and magnets.

Information Provided by Epoxy Technology

Vendors:
Available Properties
  • Specific Gravity, Part B
  • Specific Gravity, Part A
  • Viscosity, 50 rpm
  • Hardness, Shore D
  • Tensile Modulus, Storage
  • Shear Strength, Lap
  • Shear Strength, Die
  • Volume Resistivity
  • Dielectric Constant
  • Dissipation Factor
  • CTE, linear, Below Tg
  • CTE, linear, Above Tg
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp 10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Refractive Index
  • Transmission, Visible, Spectral
  • Transmission, Visible, Spectral
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Cure Time, Minimum Bond Line
  • Pot Life
  • Shelf Life
  • USP Class VI
  
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Category Notes
Plastic

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USP Class VI Adhesives
USP Class VI Approved Adhesives for Medical Device Applications
Master Bond’s biocompatible adhesives are designed to meet the needs of medical device manufacturers. Compounds withstand various types of sterilization methods.
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