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Ensinger PEI
Lord Adhesives Thermoset™ ME-525 Underfill Encapsulant
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: LORD Thermoset™ ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product developed for the encapsulation of flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.

All information provided by Lord.

Vendors:
Available Properties
  • Specific Gravity
  • Water Absorption
  • Brookfield Viscosity, Spindle CP40 @ 5rpm
  • Modulus of Elasticity, Storage
  • Shear Strength, Die
  • Volume Resistivity
  • CTE, linear, Alpha 1
  • CTE, linear, Alpha 2
  • Glass Transition Temp, Tg, TMA
  • Cure Time
  • Cure Time
  • Pot Life
  • Gel Time
  • Shelf Life
  • Potassium, K
  • Sodium, Na
  
Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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