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Master Bond adhesives
Park Aerospace Nelco® N4000-29 BC® Buried Capacitance™ Multifunctional Epoxy
Categories: Polymer; Thermoset; Epoxy

Material Notes: The Nelco N4000-29 is a lead-free, low-CTE, high Tg multifunctional epoxy substrate which has been designed for use in standard multilayer PWB designs and today’s toughest, high-performance, lead-free applications. The Nelco N4000-29 BC® is offered as a buried capacitance solution, offering a greater degree of design freedom for smaller, more reliable assemblies.

Key Features and Benefits:

  • Low Z-axis expansion
  • High Tg, excellent thermal stability and moisture resistance
  • CAF Resistant
  • Proprietary resin chemistry
  • Buried Capacitance Solution
  • Optimized FR-4 processing

Applications/Qualifications:

  • High Density Interconnects
  • Advanced Lead-Free Assembly Substrate
  • Large Format Backplanes
  • Tight Tolerance Via to Via Applications
  • High I / O Count BGA Substrates
  • Extreme Layer Count Multilayers
  • Lead-Free DCA Applications
  • High Temperature Underhood Automotive
  • Telecommunications Infrastructure
  • Sophisticated Data Storage Applications
  • RoHS Compliant
  • Meets IPC-4101/28, /98, /99 and /126 Specifications

Information provided by Park Electrochemical Corp.

Key Words: EP
Vendors:
Available Properties
  • Density, 50% Resin Content; Internal Method
  • Water Absorption, IPC-TM-650.2.6.2.1
  • Peel Strength, IPC-TM-650.2.4.8.2a, at elevated temperature
  • Peel Strength, IPC-TM-650.2.4.8, after exposure to process solutions
  • Peel Strength, IPC-TM-650.2.4.8, after solder float
  • Dielectric Constant, Split Post Cavity
  • Dielectric Constant, IPC-TM-650.2.5.5.9, RF Impedance
  • Dielectric Constant, IPC-TM-650.2.5.5.3, TFC/LCR Meter
  • Dielectric Strength, IPC-TM-650.2.5.6.2
  • Dissipation Factor, IPC-TM-650.2.5.5.9, Split Post Cavity
  • Dissipation Factor, IPC-TM-650.2.5.5.3, TFC/LCR Meter
  • Specific Heat Capacity, ASTM E1461-92
  • Thermal Conductivity, ASTM E1461-92
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.24c, TMA
  • Glass Transition Temp, Tg, IPC-TM-650.2.4.25c, DSC
  • Decomposition Temperature, IPC-TM-650.2.4.24.6, 5% weight loss; TGA
  • Flammability, UL94
  
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Manufacturer Notes:
Park Aerospace, former Park Electrochemical Corp.

Category Notes
Plastic

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