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Master Bond adhesives
Epoxy Technology EPO-TEK® H44 Gold-Filled, Electrically Conductive Epoxy
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy, Electrically Conductive

Material Notes: Product Description: EPO-TEK® H44 is a single component, gold-filled, electrically conductive epoxy adhesive designed for hybrid microelectronic packaging.

Advantages & Application Notes:

  • High viscosity paste. Users should not expect the same creamy viscosity as silver-filled epoxies.
  • Design engineers need to be aware of longer lead times and shorter shelf-life than traditional silver-filled epoxies.
  • Suggested applications for hybrid/hermetic packaging: Die-attach and SMD attach instead of silver epoxy; avoiding silver migration inside sealed packages; medical and aerospace electronics and circuits.
  • Passes NASA low outgassing standard ASTM E595 with proper cure

Information Provided by Epoxy Technology

Vendors:
Available Properties
  • Particle Size
  • Viscosity, 0.5 rpm
  • Shear Strength, Die
  • Volume Resistivity
  • Maximum Service Temperature, Air, Continuous
  • Maximum Service Temperature, Air, Intermittent
  • Minimum Service Temperature, Air, Continuous
  • Minimum Service Temperature, Air, Intermittent
  • Glass Transition Temp, Tg, Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min
  • Decomposition Temperature, Degradation Temperature
  • Cure Time, Minimum Bond Line
  • Shelf Life
  
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Manufacturer Notes:
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Category Notes
Plastic

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