| Product Description: EPO TEK® H70S is a modified version of EPO TEK® H70E, designed primarily for die stamping. It is a highly reliable, alumina- filled epoxy with a smooth, flowable consistency, designed for chip bonding in micro-electronic and opto-electronic applications. Advantages & Application Notes: - Heat-sinking adhesive. It is particularly recommended for thermal management applications where good heat dissipation is necessary.
- Easy to use. It can be screen printed, machine dispensed, stamped, or hand applied.
- Die attach adhesive designed to be used in the 300°C range to resist TC wire bonding operations. Meets JEDEC Level III and II packaging criteria.
- Excellent adhesion to ferrous and non-ferrous metals, lead-frame die paddle, glass, ceramic, kovar, and PCB.
- Can be cured very rapidly, it is an excellent material to use for making fast circuit repairs. Can be snap-cured for inline semiconductor die-bonding.
- Suggested for potting applications due to easy flow and pouring – works well with thermistors into cavities
Information Provided by Epoxy Technology |
