| Cycom® 754 has been developed to provide long out-life at ambient temperatures, combined with excellent mechanical properties generated at low cure temperatures. Cycom® 754 is a modified epoxy resin which has been specifically developed for versatile cures under vacuum only conditions; it can also be cured under pressure if required. The cure cycle can be adapted to suit the application, provided a full cure is eventually obtained – if a structure such as a hull needs to be cured in various stages, a partial cure can be done for the initial steps, provided the final laminate schedule undergoes a full cure cycle. This will not reduce the mechanical properties of the structure in any way. FM® 754 is an adhesive film that has been developed to co-cure with the Cycom® 754 prepregs. It can also be used for secondary bonding applications where necessary. Features & Benefits: - Minimum 21 days out-life at ambient temperature
- Versatile cure from 70°C (160°F) upwards, depending on application
- Developed for vacuum only curing, but can also be cured under pressure
- Excellent handling characteristics
- Optimized flow and drape characteristics
- Low density epoxy formulation
- Available as unidirectional tape and fabric prepregs with a co-curable adhesive film
Cycom® 754 - 36% - HS - 200 – 300; Cure Cycle : 5 Hours at 80°C, no dwellInformation provided by Cytec, subsequently acquired by Solvay. |
