| Description: ECOPLATE™ 5030 is a pure metal wire with a metallurgical composition free of defects or contaminates. When applied with the automated ECOPLATE process, it conforms to the substrate much like paint, but with the superior EMI shielding performance of solid metal. This highly engineered laminar film has low porosity and oxidation, and require no curing or further process. Adhesion: Adhesion of the ECOPLATE™ 5030 allow is excellent with standard plastics and metals used in electronic device parts and housings. These include PC. ABS, PC/ABS, polysulfone and other thermoset or thermoplastic injection molded polymer; and aluminum, magnesium and zinc die-cast alloys. Its corrosion resistance makes ECOPLATE™ 5030 material an excellent choice for ensuring the long-term conductivity of metallic housings. Compatibility: Following application, ECOPLATE™ 5030 material withstands low temperature solder operations, such as soldering of a shielded grounding cable onto connector back shells. The ECOPLATE™ alloy surface also functions as a replacement for plating or metallization of parts in preparation for robotic dispensing of Cho-Form® form-in-place gasketing. Information provided by Chomerics |
