Rogers Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System

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Rogers Arlon MULTICLAD™ HF Halogen-Free Low-Loss Laminate and Prepreg System (discontinued **)
Categories:	Polymer; Thermoset
Material Notes:	MULTICLAD™ HF represents the next generation low-loss thermoset and prepreg system for high-speed and high-frequency printed circuit boards. This technology combines a low-loss, high reliability thermoset resin system with non-brominated flame retardant system to create a material that is great in terms of electrical performance, durability and cost. First generation environmentally friendly laminate system with competitive Insertion Loss and Loss Tangent (Df < 0.005) for High Frequency applications Non-PTFE Formulation meets standard lead-free process requirements, while maintaining low-halogen content per current industry standards Improved thermal robustness cover competing low-loss thermoset materials for better device reliability and performance consistency over time Low Thermal Expansion and High Glass Transition Temperature minimizes potential for PTH failures and improves operating reliability Low moisture absorption for improved processing and consistent performance Decomposition temperature > 350°C is ideally suited for lead-free solder processing Low TCEr (temperature coefficient of the dielectric) minimizes electrical phase variation with temperature Certified to UL flammability requirements of UL-94 V0 Typical Applications: High-Speed Digital backplanes and server boards RF Power Amplifier motherboards Satellite receivers, LNB converters, and other Wireless devices Semiconductor burn-in-boards and other high speed, high reliability applications Information provided by Arlon Silicone Technologies Division; now a part of Rogers Corporation.
Vendors:

Available Properties

Density, ASTM D792 Method A
Water Absorption, IPC TM-650 2.6.2.1
Tensile Strength, IPC TM-650 2.4.18.3, Cross
Tensile Strength, IPC TM-650 2.4.18.3, Machine
Modulus of Elasticity, IPC TM-650 2.4.4
Flexural Strength, IPC TM-650 2.4.18.3, Cross
Flexural Strength, IPC TM-650 2.4.18.3, Machine
Compressive Modulus, ASTM D3410
Poissons Ratio, ASTM D3039, x,y
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz/35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz/35 micron); At Elevated Temperatures
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz/35 micron); After Thermal Stress
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Dielectric Constant, IPC TM-650 2.5.5.5
Dielectric Constant, IPC TM-650 2.5.5.3
Dielectric Strength, IPC TM-650 2.5.6.2
Dielectric Breakdown, IPC TM-650 2.5.6
Dissipation Factor, IPC TM-650 2.5.5.3
Dissipation Factor, IPC TM-650 2.5.5.5
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41, x,y direction
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (< Tg)
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (> Tg)
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
Glass Transition Temp, Tg, IPC TM-650 2.4.25, DSC
Decomposition Temperature, IPC TM-650 2.3.41, Initial
Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
Flammability, UL94

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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