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Flame Retardant adhesives
Cookson Group Plaskon® MUF-LFG Molded Underfill Compound for Flip Chip BGAs and CSPs, Lead-Free Green  (discontinued **)
Categories: Polymer; Adhesive; Thermoset; Epoxy; Epoxy Molding Compound

Material Notes: This material is an epoxy Molded UnderFill compound developed for transfer mold equipment to underfill, and overmold if needed, Flip Chip in Package (FC-BGA and FC-CSP) in one step. It offers high productivity with an automated, simple, robust and fast process compared to liquid encapsulation. Higher reliability is demonstrated with the material’s higher Tg, lower CTE, no particle segregation or settling and longer outlife compared to liquid encapsulants. PLASKON? MUF is the total molded underfill solution for Flip Chip in Package.

Features:

  • Higher productivity
  • Higher Tg
  • Higher reliability
  • Lower warpage
  • Lower CTE
  • Lower cost of ownership
  • Minimum 220°C reflow
  • Minimum JEDEC Level 3

Applications:

Plaskon MUF-LFG Molded Underfill is suitable for high volume underfill and overmold protection of Flip Chip BGA and CSP packages. It is suitable for stack die packages using a combination of wirebonded and flip chip dies where the c

Vendors:
Available Properties
  • Specific Gravity
  • Moisture Absorption at Equilibrium, at 85°C/85% RH, 168 hours
  • Viscosity, Shimadzu Viscosity, 1000 psi
  • Spiral Flow, at 175°C and 1000 psi
  • Ash
  • Storage Temperature, Recommended
  • Hardness, Shore D, Cull hot
  • Flexural Strength
  • Flexural Strength
  • Flexural Modulus
  • Flexural Modulus
  • CTE, linear, Alpha 1
  • CTE, linear, Alpha 2
  • Thermal Conductivity
  • Glass Transition Temp, Tg
  • Flammability, UL94
  • Mold Temperature
  • Back Pressure
  • Cure Time, In mold
  • Cure Time, Post mold
  • Gel Time, Ram follower, at 175°C and 1000 psi
  • Shelf Life, at 35°C, <40% loss of spiral flow
  • Shelf Life, at 21°C, <40% loss of spiral flow
  • Shelf Life, at 5°C, <40% loss of spiral flow
  
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Manufacturer Notes:
none

Category Notes
Plastic

**
Materials flagged as discontinued () are no longer part of the manufacturer’s standard product line according to our latest information. These materials may be available by special order, in distribution inventory, or reinstated as an active product. Data sheets from materials that are no longer available remain in MatWeb to assist users in finding replacement materials.

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Flame Retardant adhesives
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