Product Description: EPO-TEK® 301-2 is a two component optical, medical, and semiconductor grade epoxy resin, with low viscosity, long pot-life, and good handling characteristics. Advantages & Application Notes: - Suggested for LCD optical lamination and sealing of glass plates. The product can resist yellowing over 17 days of continuous UV light exposure. Suitable for LED encapsulation.
- Ease of use: potting and casting, encapsulation and adhesive.
- Semiconductor applications: underfill for flip chips, glob top encapsulation over wire bonds, spin coating at wafer level including wafer level packaging.
- Compliant adhesive that will be resistant to impact or vibrations. Low stress adhesive for bonding optics inside OEM / Scientific instruments.
- Fiber optic adhesive: bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light.
- BIOCOMPATIBLE and NON-TOXIC; complies with USP Class VI biocompatibility standards for medical devices and implantation applications.
- Adhesion to glass, quartz, metals, wood and most plastics is very good
- May also be used for impregnating wooden or porous objects for artifact restoration
- Capable of cryogenic cooling applications.
- NASA approved, low outgassing epoxy
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