Product Highlights:- Exceptionally high Tg
- Very good flow properties
- Superior chemical resistance
- Long pot life at room temperature
- Excellent electrical insulation properties
- Very good optical clarity
Kohesi Bond KB 1372-LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a convenient 100:25 (Part A: Part B) mix ratio by weight. This epoxy system offers remarkably high glass transition temperature (Tg) of > 120°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures. It takes 6 - 8 hours to cure at 70°C, 60 - 90 minutes at 100°C and 30 - 60 minutes at 125°C. KB 1372-LP offers very long working life at room temperature, low exotherm and superb flow properties allowing to cast large parts. It has an extensive service temperature range of -50°C to +200°C. This adhesive fosters outstanding mechanical strength properties, along with dimensional stability. KB 1372-LP adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers excellent chemical resistance to a variety of acids, bases, solvents and other chemicals. Part A and Part B are clear in color and the mixed epoxy offers outstanding optical clarity. KB 1372-LP is widely used in optoelectronic, fiber-optic and specialty OEM applications requiring optical clarity and good flowability. Typical Applications: - Bonding
- Sealing
- Coating
- Potting
- Encapsulation
Information provided by Kohesi Bond Custom Engineered Adhesives |
