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Chemically Resistant adhesives
Arlon Electronic Materials 91ML Low-Cost Halogen-Free Thermally Conductive Epoxy
Categories: Polymer; Thermoset; Epoxy; Epoxy, Thermally Conductive

Material Notes: Thermally conductive, multilayerable laminate and prepreg circuit board material. Available in various resin content percentages.

Arlon 91ML ceramic filled thermally conductive multifunctional epoxy laminate and prepreg products provide a low-cost, lead-free solder compatible system with enhanced heat transfer characteristics for multilayer PWBs for applications requiring thermal management throughout the entire board volume.

  • Engineered for use with metal backing for producing Metal-Clad PCBs
  • RoHS/WEEE compliant

Typical Applications:

  • High brightness LEDs
  • DC-DC power converters
  • Automotive electronics
  • Electronic designs with limited thermal management alternatives

Information provided by ARLON Electronic Materials.

Vendors:
Available Properties
  • Density, ASTM D792 Method A
  • Water Absorption, IPC TM-650 2.6.2.1
  • Flexural Strength, IPC TM-650 2.4.4
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz/35 micron); After Process Solutions
  • Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz/35 micron); After Thermal Stress
  • Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
  • Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
  • Surface Resistance, IPC TM-650 2.5.17.1, E24/125
  • Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
  • Dielectric Constant, IPC TM-650 2.5.5.3
  • Dielectric Strength, IPC TM-650 2.5.6.2
  • Dielectric Breakdown, IPC TM-650 2.5.6
  • Dissipation Factor, IPC TM-650 2.5.5.3
  • Arc Resistance, IPC TM-650 2.5.1
  • CTE, linear, IPC TM-650 2.4.41, x,y direction
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (< Tg)
  • CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (> Tg)
  • Thermal Conductivity, ASTM E1461, Z-axis
  • Thermal Conductivity, ASTM E1461, X/Y-axis
  • Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
  • Glass Transition Temp, Tg, IPC TM-650 2.4.25, DSC
  • Decomposition Temperature, IPC TM-650 2.3.41, Onset
  • Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
  • Flammability, UL94
  
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Plastic

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Chemically Resistant adhesives
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