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Chemically Resistant adhesives
Lord Adhesives CoolTherm™ EP-6035 Epoxy Encapsulant System
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: LORD CoolTherm™ EP-6035 epoxy encapsulant is a two-component system recommended for use as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting and casting product for applications where thermal conductivity and non-burning properties are required.

Features: maintains low viscosity for complete and void-free encapsulation. provides high thermal conductivity for applications where superior heat transfer is required. provides excellent high voltage insulation. exhibits low exotherm heat rise during room temperature cure. can be used on parts and devices that experience operating temperatures from-65°C to +155°C. provides excellent flame retardancy; UL 94 V-0 certified.

All information provided by Lord.

Vendors:
Available Properties
  • Specific Gravity, EP-6035 Hardener
  • Specific Gravity, Mixed
  • Specific Gravity, EP-6035 BLK Resin
  • Viscosity, EP-6035 BLK Resin
  • Viscosity, Mixed
  • Viscosity, EP-6035 Hardener
  • Hardness, Shore D, cured
  • Tensile Strength, cured
  • Volume Resistivity, ASTM D 257, cured
  • Dielectric Constant
  • Dielectric Strength, cured
  • Dissipation Factor
  • CTE, linear, cured
  • Thermal Conductivity, cured
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Flammability, UL94
  • Working Life, Mixed
  • Shelf Life, each component from date of manufacture
  
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Category Notes
Plastic

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Chemically Resistant adhesives
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