Lord Adhesives Thermoset™ ME-455-1 Epoxy Board Level Encapsulant

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Lord Adhesives Thermoset™ ME-455-1 Epoxy Board Level Encapsulant
Categories:	Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced
Material Notes:	LORD Thermoset™ ME-455-1 encapsulant is a low viscosity, one-component, semiconductor grade epoxy designed for the encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. It is formulated with high purity resins, fillers and additives to provide the ionic purity levels required for use in high-end microelectronic applications and minimize the chances of ion-induced corrosion in these devices. Thermoset ME-455-1 encapsulant offers good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces. It can be used in demanding high-end, consumer and automotive applications. All information provided by Lord.
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Available Properties
Specific Gravity Brookfield Viscosity, Spindle 14 @ 10rpm Hardness, Shore D Modulus of Elasticity, DMA Volume Resistivity Dielectric Constant Dissipation Factor CTE, linear, TMA, Alpha 1 CTE, linear, TMA, Alpha 2 Glass Transition Temp, Tg, TMA Cure Time Pot Life Gel Time Shelf Life Potassium, K Sodium, Na

Property Data

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Manufacturer Notes:
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Category Notes
Plastic

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