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Chemically Resistant adhesives
Parker Chomerics THERM-A-GAP™ A274 Highly Conformable, Thermally Conductive Gap Filler
Categories: Ceramic; Oxide; Aluminum Oxide; Polymer; Thermoset; Silicone

Material Notes: Composition: Aluminum Oxide Filled Silicone on Aluminum Foil Carrier

Description: The “original” THERM-A-GAP materials, the widely used 274 Series offers good thermal performance, a choice of standard flat or ribbed profiles, and the ability to be molded into virtually any shape or special profile. Used as PCB “blankets” or in elaborate molded configurations, they have been designed into applications as divergent as cellular phone infrastructure equipment, avionics packages. Automotive electronics, and advanced HPLC instrumentation systems. Special profiles have enabled these materials to meet extremely challenging performance requirements, such as efficient cooling of multi-processor workstations.

Product Attributes: Moderate thermal performance and Flat or ribbed sheets and custom molded shapes

Information provided by Chomerics

Vendors:
Available Properties
  • Specific Gravity, ASTM D792
  • Thickness
  • Thickness
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  • Thickness
  • Thickness
  • Thickness
  • Thickness
  • Deformation
  • Deformation
  • Deformation
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  • Deformation
  • Hardness, Shore A, ASTM D2240
  • Thermal Conductivity, Modified ASTM D5470
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Flammability, UL94
  • Shelf Life, Adhesive
  
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Category Notes
Plastic

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Chemically Resistant adhesives
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