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Chemically Resistant adhesives
Master Bond EP21TDCAOHT Two Component Thermally Conductive, Electrically Insulative Epoxy Adhesive
Categories: Polymer; Thermoset; Epoxy; Epoxy Encapsulant, Unreinforced

Material Notes: Product Description: EP21TDCAOHT is a two component, flexibilized, thermally conductive epoxy adhesive that will cure at room temperature, or more rapidly at elevated temperature. It is a good adhesive sealant, with high peel strength and tensile lap shear. It has a very convenient mix ratio(1:1), weight or volume, and is serviceable over an exceptionally wide temperature range of -100 to 400°F. As a flexibilized system, it is an ideal adhesive for bond dissimilar substrates when thermal conductivity is needed. EP21TDCAOHT has superior thermal and mechanical shock resistance and is readily thermally cyclable.

Product Advantages:

  • Convenient mixing: non-critical equal weight or volume ratio.
  • Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly; no drip application feature.
  • Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required.
  • High shear and peel strength, ideal for dissimilar substrates.
  • Good durability, thermal shock and chemical resistance.
  • High thermal conductivity with excellent electrical insulation properties.
  • Very wide service temperature range -100 to 350°F.

Information provided by MasterBond®

Vendors:
Available Properties
  • Shear Strength, after 30 days water immersion, Al/Al, Bond
  • Shear Strength, Al/Al, Bond
  • Peel Strength, T-peel
  • Volume Resistivity
  • Thermal Conductivity
  • Maximum Service Temperature, Air
  • Minimum Service Temperature, Air
  • Cure Time, 85% of maximum strength developed within
  • Pot Life, 1 quart mass
  • Pot Life, 200 gram mass
  • Shelf Life, in unopened containers
  
Property Data

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Manufacturer Notes:
Master Bond Inc.

Category Notes
Plastic

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Chemically Resistant adhesives
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