Arlon Electronic Materials 85N Polyimide Laminate and Prepreg

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Arlon Electronic Materials 85N Polyimide Laminate and Prepreg
Categories:	Polymer; Thermoset; Polyimide, TS
Material Notes:	85N is a polyimide and laminate prepreg system for PWBs requiring resistance to high temperature, both in process and in end-use application. Bromine-free chemistry provides thermal stability for applications with sustained high in-use temperatures as well as for use in lead-free soldering applications. Low Z-expansion minimizes the risk of latent PTH defects caused during solder reflow and device attachment. Up to 50% or more reduction in cure time compared with traditional polyimide cycles Electrical and mechanical properties meeting the requirements of IPC-4101/40 and /41 Toughened, Non-MDA chemistry resists drill cracking Typical Applications: PCBs that are subjected to high temperatures during processing, such as lead-free soldering Applications with significant lifetimes at high temperatures, such as aircraft engine instrumentation, down-hole drilling, under-hood automotive controls, burn-in-boards, or industrial sensors Information provided by ARLON Electronic Materials.
Vendors:

Available Properties

Water Absorption, IPC TM-650 2.6.2.1
Modulus of Elasticity, IPC TM-650 2.4.18.3
Poissons Ratio, ASTM D3039
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Process Solutions
Peel Strength, IPC TM-650 2.4.8, To Copper (1 oz./35 micron); After Thermal Stress
Peel Strength, IPC TM-650 2.4.8.2, To Copper (1 oz./35 micron); At Elevated Temperatures
Volume Resistivity, IPC TM-650 2.5.17.1, C96/35/90
Volume Resistivity, IPC TM-650 2.5.17.1, E24/125
Surface Resistance, IPC TM-650 2.5.17.1, C96/35/90
Surface Resistance, IPC TM-650 2.5.17.1, E24/125
Dielectric Constant, IPC TM-650 2.5.5.3, May vary with resin %
Dielectric Strength, IPC TM-650 2.5.6.2
Dissipation Factor, IPC TM-650 2.5.5.3
Arc Resistance, IPC TM-650 2.5.1
CTE, linear, IPC TM-650 2.4.41
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (< Tg)
CTE, linear, Transverse to Flow, IPC TM-650 2.4.24, z (> Tg)
Thermal Conductivity, ASTM E1461
Glass Transition Temp, Tg, IPC TM-650 2.4.24, TMA
Decomposition Temperature, IPC TM-650 2.3.41, Onset
Decomposition Temperature, IPC TM-650 2.3.41, 5 percent
Flammability, UL94

Property Data

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Category Notes
Plastic

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